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ZymetX2852C
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Zymet X2852C -- Underfill, Bottom Filling
Bottom filling adhesive for IC packaging is designed to flow smoothly beneath chips, filling gaps between components and substrates with precision
Zymet X2852C Underfill Adhesive Powers Reliable Protection for Advanced Electronic Packaging
Zymet X2852C is a high-performance underfill and bottom fill adhesive developed for advanced semiconductor packaging and microelectronic assembly applications
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Sanligao (Hong Kong) Co., Ltd.
Room A059, 15/F, Block A, Wah Sang Building, 14-18 Wong Chuk Yeung Street, ShaTin District, New Territories, Hong Kong
Tel：+85 259633311
Email：sales@sanligao.com
Sanligao (Vietnam) Co., Ltd.
Room 105, 1st Floor, Office Building, No. 22 Li Taizu Street, Dafu Fang, Beining City, Beining Province, Vietnam
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Shenzhen Sanligao Technology Co., Ltd.
Room 506, Zhaoye Industrial Park, No. 172, Huanguan Middle Road, Songxuan Community, Guanhu Street, Longhua District, Shenzhen
Tel：0755-83155700
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Sanligao Technology (Dongguan) Co., Ltd.
Room 1306, Building 8, Jindi Zihui Port, No. 95, Jiaoping Avenue, Tangxia Town, Dongguan
Tel：0769-82960500
Email: sales@sanligao.com