Zymet X2852C -- Underfill, Bottom Filling

Bottom filling adhesive for IC packaging is designed to flow smoothly beneath chips, filling gaps between components and substrates with precision

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ZymetX2852C

Zymet X2852C

newest Rework underfill adhesive for chips

Underfill adhesive for BGA chips

  • Product Description
  • Improve drop, shock, and vibration resistance
    Improve BLR
    Or, damage BLR
    Low CTE improves BLR
    High CTE damages BLR
    SAC CTE = 26 ppm/°C
    Sn-Bi CTE = 18 ppm/°C
     
    Bottom filling adhesive for IC packaging is designed to flow smoothly beneath chips, filling gaps between components and substrates with precision. It reinforces solder joints, absorbs mechanical stress, and improves resistance to thermal cycling, vibration, and moisture. With excellent adhesion and controlled curing, it enhances electrical reliability while extending device lifespan. This adhesive supports miniaturized, high-density packaging by reducing failure risks and ensuring stable performance in demanding electronic applications.

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Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

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