Zymet X2852C -- Underfill, Bottom Filling
Bottom filling adhesive for IC packaging is designed to flow smoothly beneath chips, filling gaps between components and substrates with precision
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ZymetX2852C
Zymet X2852C
newest Rework underfill adhesive for chips
Underfill adhesive for BGA chips
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Improve drop, shock, and vibration resistanceImprove BLROr, damage BLRLow CTE improves BLRHigh CTE damages BLRSAC CTE = 26 ppm/°CSn-Bi CTE = 18 ppm/°CBottom filling adhesive for IC packaging is designed to flow smoothly beneath chips, filling gaps between components and substrates with precision. It reinforces solder joints, absorbs mechanical stress, and improves resistance to thermal cycling, vibration, and moisture. With excellent adhesion and controlled curing, it enhances electrical reliability while extending device lifespan. This adhesive supports miniaturized, high-density packaging by reducing failure risks and ensuring stable performance in demanding electronic applications.
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Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.
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