Dymax Mask UV Shielding Adhesive 9-20479-B-REV-A

Dymax® Quick-Cure Masking Adhesive 9-20479-B-REV-A is a blue, UV-curable masking material that cures rapidly under UV/visible light irradiation, making it ideal for quick masking of electronic components and assemblies. This product is easy to peel off, completely eliminating ion contamination or silicone-related issues often associated with other masking methods. Typical applications include: ▸ Area masking in conformal coating processes ▸ Solder joint protection during wave soldering and reflow soldering The material is halogen-free and contains no added solvents. As a peelable masking adhesive, it ensures precise protection of non-coated areas during conformal coating while demonstrating excellent compatibility with gold and copper pins. Dymax® 9-20479-B-REV-A boasts exceptional thixotropic properties, allowing it to be applied manually or via automated dispensing systems onto circuit boards or components with complex geometries—areas that are typically challenging to mask using conventional techniques. Dymax materials are solvent-free and cure instantly upon exposure to light, significantly reducing processing costs due to their rapid curing speed. When used in conjunction with Dymax UV spotlights, flood lights, focused lamps, or conveyor-based curing systems, this adhesive delivers optimal curing speed and performance, ensuring maximum process efficiency. Dymax light sources are precisely tuned to deliver the ideal balance of UV and visible light wavelengths, enabling the fastest and deepest curing possible. Dymax® Quick-Cure Masking Adhesive 9-20479-B-REV-A fully complies with the requirements of the EU RoHS Directive 2015/863/EU.

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    SpeedCure Masking Adhesive® 9-20479-B-REV-A is a blue light-curable masking material that cures rapidly under UV/visible light, making it ideal for quick masking of electronic components and assemblies. This product is easy to peel off, completely eliminating ion contamination or silicone-related issues that may occur with other masking methods. Typical applications include:
    ▸ Area Masking in the Three-Proof Coating Process
    ▸ Solder Joint Protection in Wave Soldering and Reflow Soldering Processes

    This material features halogen-free properties and contains no added solvents. As a peelable masking tape, it precisely protects areas where coating is prohibited during the three-proof coating process, while also demonstrating excellent compatibility with gold- or copper-plated pins. The 9-20479-B-REV-A boasts outstanding thixotropy, allowing it to be applied manually or via automated dispensing onto circuit boards or components with intricate structures—areas that are often challenging to treat using conventional masking techniques.

    Dymax materials are solvent-free and cure instantly upon exposure to light. Their second-level curing speed significantly reduces processing costs. When used in conjunction with Dymax UV spotlights, floodlights, projectors, or conveyor-belt curing systems, these materials deliver optimal curing speed and performance, ensuring maximum process efficiency. Dymax light sources are meticulously engineered to balance ultraviolet and visible light wavelengths, enabling the fastest and deepest curing results possible.

    Speedbond Masking Tape® 9-20479-B-REV-A fully complies with the requirements of the EU RoHS Directive 2015/863/EU.

     

     

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Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

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