Process protection glue/mask

Fast-curing masking adhesive, rapidly cures under UV/visible light, used for quick masking of electronic components and assemblies. This product is easy to peel off, completely eliminating ionic contamination or silicone issues that may be left by other masking methods. Typical applications include:
▸ Area masking in conformal coating processes
▸ Solder joint protection in wave soldering and reflow soldering processes

This material is halogen-free and solvent-free. As a peelable masking adhesive, it precisely protects areas that should not be coated during conformal coating and has excellent compatibility with gold/copper pins. It has excellent thixotropy and can be applied to circuit boards or special structural components—areas that are often difficult to handle with other masking techniques—by manual or automatic dispensing.

Dymax materials are solvent-free and cure upon light exposure. Its seconds-cure characteristic significantly reduces processing costs. When used with Dymax UV spot lights, flood lights, or conveyor belt curing systems, optimal curing speed and performance are achieved, ensuring maximum process efficiency. Dymax light curing equipment carefully balances UV and visible light wavelengths to achieve the fastest and deepest cure.

The fast-curing masking adhesive® fully complies with the requirements of EU RoHS Directive 2015/863/EU.