Dymax AA Adhesive: 9906-AA Low-Shrinkage Dual-Cure Epoxy Resin for Dymax Active Focusing Process
Dymax light-curing adhesives are the ideal choice for assembling camera modules in automobiles and other vehicles. Our single-component adhesives contain no added solvents and cure within seconds under light exposure, significantly reducing assembly time while lowering both product costs and environmental impact. They exhibit exceptional bonding performance on commonly used automotive substrates, such as plastics, metals, or glass. Additionally, these camera module adhesives can withstand harsh conditions frequently encountered in automotive applications—like moisture and thermal shock—while maintaining an extremely low shrinkage rate. - Rapid LED or UV/visible light curing - Low-temperature thermal curing (80–85°C) - Minimal shrinkage - Single-component formulation, requiring no mixing - Passed ASTM E595 outgassing test - Enhanced resistance to 85°C / 85% RH conditions - Viscosity (nominal): 86,000 cps - Appearance before curing: Grayish-white opaque to charcoal-gray semi-transparent gel - Volume shrinkage: 1.1% - Recommended surfaces: LCP, PCB, PPS, FPC, and metal - Compatible substrates: ABS, CAP, FR-4 board, LCP, PC, PET, PPS, PS, stainless steel, aluminum, glass, and magnesium
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Low shrinkage epoxy resin adhesive
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Low-shrinkage cationic epoxy resin adhesive, designed for the active alignment market
Dymax 9906-AA is a thermally and/or LED-curable epoxy resin adhesive specifically designed for use in Asia. This AA-grade adhesive meets NASA ASTM E595 low-outgassing specifications, making it ideal for critical optical components, camera modules, LiDAR (Light Detection and Ranging), and other ADAS (Advanced Driver Assistance Systems) components.9906-AA offers flexibility to cure within seconds after exposure to LED and/or UV/visible light, as well as low-temperature heat, making it suitable for a wide range of applications—including lens bonding, attaching barrel assemblies to brackets, or securing brackets to printed circuit boards (PCBs).
This epoxy resin adhesive offers superior resistance to 85°C/85% RH conditions, exhibiting minimal overall movement during thermal cycling. It also features higher viscosity and thixotropic properties, allowing it to maintain the bead shape during dispensing.
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