In-vehicle chip enhanced application

Application Scenarios:

Left and right domain controllers, BMS, ADAS, T-BOX, intelligent cockpit, and various chip reinforcements (Underfill & Edgebond)

 

Application Images:

Recommended Product Types:

Test Feedback:

Acceleration Shock Test Results:                                                           Thermal Shock Test

Key Product Parameters:

Model

Product Type

Viscosity (cps)

CTE

TG

Operating Time @25℃

Curing

Storage Temperature

X2822

Underfill

1100

30

130

3Days

150℃ @ 1min

-5℃

X2852

Underfill

780

30

135

3Days

150℃ @ 1min

-5℃

X2852C

Underfill

1500

32

146

3Days

150℃ @ 5min

-5℃

2605-B

Edgebond

220000

30

134

14 Days

150℃ @ 1min

-5℃

3307-B

Edgebond

530000

15

149

7 Days

150℃ @ 1min

-5℃