Solutions
In-vehicle chip enhanced application
Application Scenarios:
Left and right domain controllers, BMS, ADAS, T-BOX, intelligent cockpit, and various chip reinforcements (Underfill & Edgebond)
Application Images:



Recommended Product Types:
Test Feedback:
Acceleration Shock Test Results: Thermal Shock Test


Key Product Parameters:
Model |
Product Type |
Viscosity (cps) |
CTE |
TG |
Operating Time @25℃ |
Curing |
Storage Temperature |
X2822 |
Underfill |
1100 |
30 |
130 |
3Days |
150℃ @ 1min |
-5℃ |
X2852 |
Underfill |
780 |
30 |
135 |
3Days |
150℃ @ 1min |
-5℃ |
X2852C |
Underfill |
1500 |
32 |
146 |
3Days |
150℃ @ 5min |
-5℃ |
2605-B |
Edgebond |
220000 |
30 |
134 |
14 Days |
150℃ @ 1min |
-5℃ |
3307-B |
Edgebond |
530000 |
15 |
149 |
7 Days |
150℃ @ 1min |
-5℃ |
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