Vital Thermal Conductive Adhesive

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  • Product Description
  • An effective method for heat transfer between the radiator and electronic components

    DYMAX Multi-Cure ® Thermal interface materials can be cured using light, heat, or a catalyst. For most applications, combining all three methods achieves optimal and rapid curing. Light curing allows immediate solidification of exposed areas, while shadowed regions can later be treated with either a catalyst or heat curing—without disrupting the overall process. DYMAX thermal interface materials deliver a thermal conductivity of up to 0.9 W/m*K. Additionally, this product boasts high viscosity and excellent thixotropy, making it the ideal coating material for precise application.

     

    Product Model

    Product Description

    Scope of application

    Curing method

    Thermal conductivity

    Viscosity cP

    Shear Strength

    9-20801

    High intensity

    Used for permanent fixation

    UV, catalyst, or heat

    0.9 W/m·K

    110,000

    2,100 psi

     

    Chip Thermal Conductivity

    ◆ Cures in seconds◆ No refrigeration required
    ◆ High-Viscosity Bonding◆ Low Stress Due to Thermal Expansion Coefficient Mismatch
    ◆ Repairable and Self-Filling Level◆ No mixing, no thawing
    ◆ Multiple Curing Methods 

     

     

    For more information, please call our service hotline at 0755-83155700 or 13902962580, or email us at sales@sanligao.com. You can also reach us via QQ: 89204599.

FAQ

Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

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