Vital Thermal Conductive Adhesive
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Keywords:
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An effective method for heat transfer between the radiator and electronic components
DYMAX Multi-Cure ® Thermal interface materials can be cured using light, heat, or a catalyst. For most applications, combining all three methods achieves optimal and rapid curing. Light curing allows immediate solidification of exposed areas, while shadowed regions can later be treated with either a catalyst or heat curing—without disrupting the overall process. DYMAX thermal interface materials deliver a thermal conductivity of up to 0.9 W/m*K. Additionally, this product boasts high viscosity and excellent thixotropy, making it the ideal coating material for precise application.
Product Model
Product Description
Scope of application
Curing method
Thermal conductivity
Viscosity cP
Shear Strength
9-20801
High intensity
Used for permanent fixation
UV, catalyst, or heat
0.9 W/m·K
110,000
2,100 psi

Chip Thermal Conductivity
◆ Cures in seconds ◆ No refrigeration required ◆ High-Viscosity Bonding ◆ Low Stress Due to Thermal Expansion Coefficient Mismatch ◆ Repairable and Self-Filling Level ◆ No mixing, no thawing ◆ Multiple Curing Methods For more information, please call our service hotline at 0755-83155700 or 13902962580, or email us at sales@sanligao.com. You can also reach us via QQ: 89204599.
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Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.
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