TS Meterials Conductive Adhesive 216C

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  • Product Description
  • Conductive Silver Adhesive – STS-216C  
    Product Overview  
    STS-216C is a silver-powder-based epoxy conductive adhesive that offers high thermal and electrical conductivity.  
    Featuring high adhesive strength, excellent high-temperature resistance, superior reliability, outstanding thermal conductivity, and exceptional rheological properties, it is ideal for high-speed dispensing applications. 
    Main applications  
     High-power product packaging, such as outdoor LEDs, and more 
       
    Typical process reference  
       
    Technical indicators
    Performance before curing
    Project (Unit)Test Method/ConditionsData
    Filler type: Silver Silver
    Thixotropic Index0.5 rpm / 5 rpm at 25°C6.1
    Viscosity (cP)Brookfield CP5, 2.5 rpm, 25°C18000
    Working hours25°C viscosity increases by 25%24
    Validity Period (years)Below -40°C1
    Curing Conditions and Curing Process
    Suggested curing conditions: Heat up at 3–5°C/min to 200°C, then hold at that temperature for 1 hour (gradual heating helps minimize bubble formation and enhances bonding strength). 
                  Heat at 3–5°C/min up to 160°C, then hold at that temperature for 2 hours (gradual heating helps reduce bubble formation and enhances bonding strength).
    Post-curing performance
    Project (Unit)Test Method/ConditionsData
    Volume Resistivity (Ω-cm)4-Point Probe Method2 × 10 - 5
    Chip Shear Strength (g) 
    3.5mm x 3.5mm Warm-Plate Ag/Cu
    25°C101
    260°C54
    Thermal conductivity (W/(m·K))Laser Flash Method: 121°C20
    Tg (°C)DSC (20°C/min)180
    Thermal expansion coefficients below Tg (ppm/°C)TMA Expansion Probe55
    Thermal expansion coefficient above Tg (ppm/°C)TMA Expansion Probe170
       

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