Momentive Thermal Conductive Sealant GapFiller

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  • Product Description
  • ModelTIA 241GFTIA 2101GF
    ComponentTwo-component, 1:1Two-component, 1:1
    ColorPale bluePink
    Specific gravity2.6 g/cm³3.1 g/cm³
    Viscosity130 Pa·sPaste-like
    Hardness45A10A
    Curing conditions3 hours (operating time)1-hour full solidification (70°C) 
    24-hour solid state (24°C)
    Elongation rate40%/
    Thermal conductivity4.1W/m-K10.0W/m-K
    Dielectric strength14KV/mm15KV/mm
    Volume Resistivity1.0 × 10⁴ MΩ·m3.0 × 10¹³ MΩ·m
    Packaging400 ml, 25 kg600ML 
    Success StoriesOBC unit, replacing the thermal padOBC unit, replacement thermal conductive gasket

    Momentive Thermal Conductive Sealant GapFiller is designed to enhance heat transfer in electronic devices. With excellent thermal conductivity and flexible sealing performance, it effectively fills gaps between components, improving cooling efficiency and system reliability. The material helps protect sensitive electronics from overheating while supporting stable operation in demanding environments.

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Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

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