Momentive Thermal Conductive Adhesive
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To address the new thermal management challenges brought about by the industry's trends toward higher frequencies, greater power levels, and miniaturization of components, Momentive’s scientists have developed a wide range of thermal management material products—and continue to refine and upgrade them relentlessly.
Our thermal management material series features exceptional thermal conductivity and consistently stable heat transfer performance, helping to enhance the efficiency and reliability of these electronic devices. Our product lineup includes composite greases, adhesives, encapsulating resins, potting compounds, and dispensable thermally conductive pads—each designed with outstanding performance characteristics, such as a thin adhesive layer and minimal mass loss even at high temperatures. The products are as follows:Thermal Conductive Gap Filler

Thermal Potting Compound

Thermal Adhesive

Thermal Grease

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