Momentive Thermal Conductive Adhesive TIA 350R/TN 3085

Momentive Thermal Conductive Adhesive TIA 350R/TN 3085 is engineered for reliable bonding and efficient heat dissipation in electronic assemblies

Keywords:

  • Product Description
  • ModelTIA 350RTN 3085
    ComponentSingle-componentSingle-component
    ColorGrayGray, white
    Specific gravity3.1 g/cm³1.63 g/cm³
    Viscosity67 Pa·sPaste-like
    Hardness77A46A
    Curing conditions30 minutes (120°C)7-minute surface dry (23°C)
    Elongation rate20%150%
    Dielectric constant (60 Hz)2.74.0
    Thermal conductivity3.5W/m-K0.7W/m-K
    Dielectric strength20KV/mm23KV/mm
    Volume Resistivity4.8 × 10⁶ MΩ·m4.0 × 10¹⁴ MΩ·cm
    Packaging400 ml, 25 kg4.2kg
    Success StoriesStart-stop deviceTransistor Heat-Sink Adhesive

    Momentive Thermal Conductive Adhesive TIA 350R/TN 3085 is engineered for reliable bonding and efficient heat dissipation in electronic assemblies. With excellent thermal conductivity and durable silicone performance, it helps transfer heat away from sensitive components while maintaining stable adhesion. This adhesive supports long-term reliability in demanding applications such as power modules, LED systems, and high-performance electronics.

FAQ

Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

Honors and Qualifications

prev
next

Product Inquiry

We will reply to you within one working day. Please keep your phone open.

%{tishi_zhanwei}%