Huitian Heavenly Return Bottom Filling Adhesive

"Huaitian Company offers a variety of solutions for chip underfilling, designed to meet the diverse needs of different testing scenarios."

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  • "Huaitian Company offers a variety of solutions for chip underfilling, designed to meet the diverse needs of different testing scenarios."


    Epoxy Product Adhesive Solutions
    Underfill (Bottom fill) 
    663X  Series

    ● Motherboard CSP or flip-chip BGA available 
    ● Medium- and Low-Temperature Rapid Curing

    ● Excellent liquidity and workability

    ● CTE values are optional, modulus is optional

    ●Optional reworkability

    Serial NumberPerformanceUnit6631 6631H6631D6632 
    1 Color——BlackBlackBlackBlack
    2 Viscosity25°C, mPas480 600 12000 5000 
    Curing conditions——30 min, 115°C10 min, 130°C15 min, 130°C60 min, 120°C
    TMATg, °C100 110 130 100 
    CTE1, ppm/°C65 50 24 39 
    CTE2, ppmC199 165 95 122 
    Storage modulus25℃, MPa3300 5000 15000 6500 
    Working hoursSky3 
    Storage temperature°C-20-20-40-40  
    Repairability——GoodGoodNon-refundableNon-refundable
    Product Features——Versatile—compatible with both soft FPC and rigid PCB materials.PCB, low CTE, reworkable1W Thermal Conductive Base FillerHigh reliability, flip-chip

FAQ

Sanligao Technology is a professional one-stop chemical solution service provider for the new energy, energy storage, automotive electronics, semiconductor, microelectronics, communication, medical, military and other fields.

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