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Huitian Edge-Bonding Four-Point Bonding Adhesive

Huitian Company, an innovative enterprise that has consistently remained at the forefront of technology, has successfully launched a series of remarkable, high-quality products in the cutting-edge field of chip quad-flat-pack (QFP) bonding—thanks to its outstanding technological expertise and unwavering spirit of innovation. These products not only highlight Huitian’s deep-rooted expertise in chip packaging technology but also underscore its keen market insight and robust execution capabilities in meeting customer demands and driving industry growth. Huitian’s QFP bonding solutions leverage advanced materials and state-of-the-art processes, ensuring stable and reliable connections between chips and substrates. Through meticulous design and precision manufacturing, these products effectively withstand external environmental challenges—such as temperature fluctuations and humidity variations—thereby maintaining the exceptional performance and reliability of electronic devices even under prolonged operation.

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best Edgebond repairable black adhesive

Product Description

Huitian Company, an innovative enterprise that has consistently remained at the forefront of technology, has successfully launched a series of outstanding, high-quality products in the cutting-edge field of chip quad-flat-pack (QFP) bonding—thanks to its exceptional technical expertise and unwavering commitment to innovation. These products not only highlight Huitian’s deep-rooted expertise in chip packaging technology but also underscore its keen market insight and robust execution capabilities in meeting customer demands and driving industry growth. Huitian’s QFP bonding solutions leverage advanced materials and state-of-the-art manufacturing processes, ensuring stable and reliable connections between chips and substrates. Through meticulous design and precision engineering, these products effectively withstand external environmental challenges—such as temperature fluctuations and humidity variations—thereby maintaining the high performance and reliability of electronic devices even under prolonged operation.

Epoxy Product Adhesive Solutions

Edge-bonding

664X Series, 370 X Series

● Optional curing methods available (thermosetting, UV curing)

● Low CTE, High Tg

● Viscosity options available

●Optional reworkability

Serial Number	Performance	Unit	6646	6645B	6646R	3701	3703
1	Color	——	Black	Black	Black	Transparent	Transparent
2	Viscosity	25°C, mPa·s	500000	14000	12000	160000	160000
3	Curing conditions	——	30 min, 150°C	25 min, 125°C	25 min, 125°C	365nm 500mW/10S	365nm 500mW/10S
4	TMA	Tg, °C	145	130	120	148	175
		CTE1, ppmC	20	32	50	28	23
		CTE2, ppmC	82	114	165	70	68
5	Storage modulus	25℃, MPa	11000	10000	5000	4100	6100
6	Working hours	Sky	2	2	2
7	Storage temperature	°C	-40	-40	-40	-20	-20
8	Repairability	——	Non-refundable	Non-refundable	Refundable for repair	Refundable for repair	Refundable for repair
9	Product Features	——	Routine applications High reliability	In-vehicle Good craftsmanship	Communication Refundable for repair	Routine applications	High modulus, high Tg

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