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Bostik Thermal Conductive Adhesive
As a leader in the adhesive industry, Bostik's thermal conductive product line has carved out a prominent position in the market thanks to its exceptional performance. These thermal adhesives not only deliver outstanding heat-conduction capabilities, efficiently transferring heat away from heat-generating components to cooling devices—ensuring stable operation and extending the lifespan of electronic equipment—but also exhibit superior bonding strength and temperature resistance, making them well-suited for a wide range of complex and ever-changing operational environments. Bostik's thermal adhesives are widely applied across multiple high-tech sectors, including automotive electronics, LED lighting, communication devices, aerospace, and more, providing indispensable thermal management solutions for modern industrial manufacturing. Through continuous innovation and R&D, Bostik remains at the forefront of advancing thermal material technologies, relentlessly addressing the market's growing demands for efficient heat dissipation, lightweight designs, and eco-friendly, energy-saving solutions—ultimately helping customers unlock greater value.
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As a leader in the adhesive industry, Bosilong's thermal conductive product line has carved out a prominent niche in the market thanks to its exceptional performance. These thermal adhesives not only deliver outstanding heat-conduction capabilities, efficiently transferring heat from heat-generating components to cooling devices—ensuring stable operation and extending the lifespan of electronic equipment—but also exhibit superior bonding strength and temperature resistance, making them well-suited for a wide range of complex and dynamic operating environments. Bosilong’s thermal adhesives are widely applied across multiple high-tech sectors, including automotive electronics, LED lighting, telecommunications equipment, and aerospace, providing indispensable thermal management solutions for modern industrial manufacturing. Through continuous innovation and R&D, Bosilong remains at the forefront of advancing thermal material technologies, consistently addressing the market’s growing demands for efficient heat dissipation, lightweight designs, and eco-friendly, energy-saving solutions—ultimately helping customers unlock greater value.
Polytec PT Polytec PT Product Name Component Viscosity
[cps]Maximum operating temperature
[℃]Curing conditions Thermal conductivity
[W/(m·K)]Insulating property Product Features TC 301 1C 43,000 180 120°C @ 50 min 1.9 Mild / TC 351 1C 65,000 200 120°C @ 45 min 0.8 Y Insulation TC406 2C 180,000 150 RT 2.2 Y High thermal conductivity TC 411 2C 140,000 150 RT 1.4 Y Exceptional toughness TC417-2 2C 4,000 180 RT 0.8 Y Potting VP 2040-1 2C 4,200 150 RT 10 Y Potting VP 2041 2C 8,300 180 RT 1.6 Y Potting TC 423-2 2C 87,000 160 RT 3.1 Y High thermal conductivity and adhesion TC430 2C 13,000 250 100°C for 60 minutes
150°C @ 15 min0.7 Y Excellent temperature resistance TC433 2C 25,000 220 100°C for 60 minutes
150°C @ 15 min2.0 Y Highly thermally conductive bonding; excellent temperature resistance TC 437 2C 5,500 180 RT 0.6 Y / TC 488 2C 135,000 150 RT 1.0 Y Exceptional toughness Polytec PT- Thermal Conductive Caulking Material Polytec PT Product Name Component Viscosity
[cps]Maximum operating temperature
[c】Curing conditions Thermal conductivity
[W/(m·K)]Product Features GF 180 2C 70,000 80 RT 1.8 / GF 300-LV 2C 60,000 80 RT 3.0 Good liquidity GF 320 2C 70,000 80 RT 3.2 High thermal conductivity GF-HT 200 2C / 150 RT 2.0 Excellent temperature resistance Product Name Component Viscosity
[cps]Maximum operating temperature
[C]Curing conditions Thermal conductivity
[W/(m·K)]Product Features TP 230 1C 180,000 (40°C) 80 No 2.3 / VP 2106-408 1C 160,000 80 No 2.7 High thermal conductivity TP 300 1C 160,000 (40°C) 80 No 3.0 High thermal conductivity
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