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Bostik Conductive Adhesive

As a leader in the adhesive industry, Bostik boasts a diverse and extensive lineup of conductive adhesives, widely used across multiple high-tech sectors including electronics, telecommunications, automotive, and new energy. Renowned for their exceptional conductivity, reliable bonding strength, and outstanding environmental adaptability, these conductive adhesives effectively minimize electrical resistance in circuit connections, boosting signal transmission efficiency while streamlining manufacturing processes and mitigating thermal and mechanical stresses typically associated with traditional soldering techniques. Whether applied to the precise alignment of tiny electronic components or integrated into the packaging of large-scale integrated circuits, Bostik’s conductive adhesives consistently deliver superior reliability and durability—providing indispensable support for the ongoing trend toward thinner, lighter, and more integrated modern electronic devices. Moreover, Bostik remains committed to continuous innovation in conductive adhesive materials, driving forward advancements in electronic packaging technology by meeting the ever-growing market demand for higher-performance, eco-friendly solutions that pave the way for sustainable technological progress.

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As a leader in the adhesive industry, Bostik boasts a diverse and comprehensive lineup of conductive adhesives, widely used across multiple high-tech sectors including electronics, telecommunications, automotive, and new energy. Renowned for their exceptional conductivity, reliable bonding strength, and outstanding environmental resilience, these conductive adhesives effectively minimize electrical resistance in circuit connections, boosting signal transmission efficiency while streamlining manufacturing processes. This approach also helps mitigate thermal and mechanical stresses often associated with traditional soldering methods. Whether applied to the precise alignment of tiny electronic components or integrated into the packaging of large-scale integrated circuits, Bostik’s conductive adhesives consistently deliver superior reliability and durability—providing critical support for the ongoing trend toward thinner, lighter, and more compact modern electronic devices. Moreover, Bostik remains committed to driving innovation in conductive adhesive materials, continuously developing cutting-edge solutions that meet the growing market demand for higher-performance, eco-friendly alternatives. By pushing the boundaries of electronic packaging technology, Bostik is helping pave the way for sustainable advancements in the industry.

※Here is Bostik Summary of Conductive Adhesive Products:
Product Name	Component	Filler	Curing conditions	Shear Strength (MPa)	Modulus (MPa)	Volume Resistivity (ohm·cm)	Typical applications
Polytec EC 101 L-Frozen	Single	Silver	150°C / 5 min 180C/4Os	8	7,000	1-4E-4	PCB applications, chip soldering—can be used as a solder paste alternative
Polytec EC 112 L-Frozen	Single	Silver	150°C / 5 min 180C/40s	8	4,700	2-4E-4	Semiconductive applications, which can be used to provide conductivity in flip-chip technology. Using (the large chip)
Polytec EC 151 L-Frozen	Single	Silver	150°C / 5 min 180°C / 40s	/	7,000	3-6E-4	Semiconductive applications, which can be used to provide conductivity in flip-chip technology. Using (small chips)
Polytec EC 201-2	Double	Silver	100°C / 30 min 150°C / 10 min	/	/	2-5E-4	Highly flexible, designed for low-stress applications, especially in Healthcare industry
Polytec EC 242-Frozen	Single	Silver	150°C / 30 min 180°C / 2 min	7.0	9,000	5E-5	High Tg, Thermal and Electrical Conductivity
Polytec EC 244	Double	Silver	23°C / 4 hours 50°C / 60 min	7.8	4,800	<5E-3	Low-temperature curing application, for chip packaging
Polytec PU 1000	Single	Silver	23°C / 4 hours	/	200	2-4E-4	High flexibility, smart card usage

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