As electronic packages become smaller and more powerful, manufacturers need bonding materials that protect solder joints without slowing production. Zymet 3307-B is a high-performance edgebond adhesive for BGA, CSP, WLCSP and other surface-mount packages. Its high Tg, low CTE and stable electrical performance strengthen package edges and corners, improving board-level reliability.
In automotive electronics, 5G devices and industrial controls, components may face drops, vibration, shock and temperature changes. Zymet 3307-B helps distribute mechanical stress and reduce damage caused by thermal expansion mismatch. It cures quickly, at relatively low temperatures and provides strong adhesion to silicon and organic substrates, supporting reliable bonding and efficient production.
Conventional underfill can require preheating and capillary flow, while voids and flux residues may create risks. Zymet 3307-B reinforces the package perimeter, simplifying processing, improving repeatability and reducing failure risks.

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