For flip chip attachment or electrical grounding
ACP's for Electrical Interconnection
Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and chip-on-flex attachment for RFID and smartcard assembly.
Features of Zymet's anisotropically conductive pastes include:
Gold coated spherical polymer particles as fine as 3 microns
High stability of dispersion to ensure random particle distribution
High electrical isolation of particles to eliminate short circuits
Fine pitch resolution — as fine as 35 microns
Thermal curing or UV curing in 10 seconds or less. UV curable versions require the use of a UV transparent substrate, such as glass.
ACP'S for Electrical Grounding
ACP’s designed for electrical grounding applications utilize uniformly sized, spherical conductive particles that are sized to bridge the thickness of the bondline, to create an electrical contact between two substrates. These ACP's provide the following features and benefits:
One component, syringe dispensable systems
Very low and stable contact resistance across a bondline
Snap curing in 60 seconds or less, or longer conventional oven curing
Ultra-low stress bonding
For more information about specific applications and products, please Contact us!
