Devcon TB25

T-Bond 25

Two-component epoxy, High thermal conductivity

PRODUCT DESCRIPTION

T-Bond 25 is a two-component epoxy adhesive with high thermal conductivity, low viscosity and high bonding performance. It has following features:

• High thermal conductivity.

• Does not contain solvent.  

• High bonding strength.

This product can be used as Adhesive to bond most metals, plastics and ceramic substrates, including aluminum, stainless

steel and PCB board. To bond PCB board and aluminum substrates, it could be widely used on LEDs which need quick heat

dissipation.

PRODUCT CHARACTERISTICS

Chemical Class              Epoxy

Appearance(mixed)           Brown

Mix Ratio, by volume  

Resin : Hardener            2:1

Mix Ratio, by weight

Resin : Hardener            100:36

Viscosity                   Low

Working time @ 25ºC , hrs   1-2

PROCESSING

The surfaces must be dry, degreased and dust free. The treatment may be varied according the substrate (paper sanding, degreasing, Corona treatment, etc.): consult with the technical service.   Weigh  A&B  exactly  according  to  the  mix  ratio  and then  mix  well  until  the  colors  are  homogenous (Different  colors  of  A&B  are  designed  to  help judgment).  Apply  mixed  adhesive  directly  to  the surface,  then  assemble  with  mating  part  within recommended working  time  (1-2  hrs).  Apply  firm pressure between mating parts to minimize any gap and ensure good contact, and then cure the sample as cure condition describes.

PRECAUTIONS

Please refer to the appropriate material safety data sheet (MSDS) prior to using this product.

STORAGE

Store  the  unopened  product  in  a  cool,  dry,  well ventilated  location  away  from  sources  of  heat.   Optimal storage temperatures should range between 10^oC (50^oF) and 18oC (64^oF). Product removed from the containers during use should not be returned to  original  containers  in  order  to  avoid  potential contamination.